Method of manufacturing an ultra-high density warp-resistant memory module
AssigneeStaktek Corporation
InventorCarmen D. Burns
Life of this patent
Estimating the term…
Abstract
An ultra high-density integrated circuit module which includes a plurality of individual high-density integrated circuit packages. A plurality of the ultra high-density integrated circuit memory modules may be combined to form an ultra high-density memory bank for use in computers, or other applications requiring high-density on-board memory. The high-density integrated circuit packages which form the modules each have an internal lead frame and optional internal member which overlie an integrated circuit die. A thin, warp-resistant metal layer and an external heat conductor element are mounted to the exterior of the package. Heat is dissipated from the package while structural forces are selectively balanced.
Claims14
A method of manufacturing an ultra-high density memory module, comprising the steps of:
- forming a high density memory package by:
- mounting a substantially planar internal lead frame, comprised of a plurality of circuit conductors, to an integrated circuit die so said lead frame overlays and is in thermal contact with at least a portion of said die;
- mounting a substantially planar thermally conductive internal element so it overlays and is in thermal contact with at least a portion of said die;
- encapsulating said die, said internal lead frame and said thermally conductive internal element to form a protective casing, such that a plurality of said circuit conductors extend through a first end of said casing to form leads and wherein an end portion of said thermally conductive internal element extends through a second end of said casing, opposite said first end;
- mounting a thin, warp-resistant metal layer to a first major surface of said casing;
- mounting a substantially planar external thermally conductive element to a second major surface of said casing;
- and
- vertically orienting a plurality of said packages and mounting said packages adjacent one another to form an ultra-high density memory module.
A method of manufacturing an ultra-high density memory module, comprising the steps of:
- forming a plurality of high density memory packages, each package formed by:
- mounting a substantially planar internal lead frame, comprised of a plurality of circuit conductors, to an integrated circuit die so said lead frame overlays and is in thermal contact with at least a portion of said die;
- encapsulating said die and said internal lead frame to form a protective casing, such that a plurality of said circuit conductors extend through a first end of said casing to form leads, and wherein a substantial portion of a major surface of said integrated circuit die is exposed through said casing;
- and
- mounting a substantially planar external thermally conductive element to said exposed major surface of said die;
- mounting a thin, substantially planar, warp-resistant metal layer to a major exterior surface of said casing of one or more of said packages;
- and
- orienting a plurality of said packages and mounting said packages adjacent one another to form an ultra-high density memory module, wherein said warp-resistant layer substantially reduces the tendency of said module to warp.
A method of manufacturing an ultra-high density memory module, comprising the steps of:
- forming a plurality of high density memory packages, each package is formed by:
- mounting a substantially planar internal lead frame, comprised of a plurality of circuit conductors, to an integrated circuit die so said lead frame overlays and is in thermal contact with at least a portion of said die;
- mounting a substantially planar thermally conductive internal element so it overlays and is in thermal contact with at least a portion of said die;
- and
- encapsulating said die, said internal lead frame and said thermally conductive internal element to form a protective casing, such that a plurality of said circuit conductors extend through a first end of said casing to form leads and wherein an end portion of said thermally conductive internal element extends through a second end of said casing, opposite said first end;
- and
- mounting said packages adjacent one another to form an ultra-high density memory module.
Dependencies are inferred from the claim text.