Circuit module redundancy architecture process

A method for forming a first semiconductor device having a first size and a second semiconductor device having a second smaller size using a single mask set, the method comprising the steps of:

• forming a plurality of circuit blocks on a semiconductor substrate, each circuit block of said plurality of circuit blocks comprising a plurality of replaceable circuit modules;
• forming programmable interconnect circuitry extending to each of the circuit modules, wherein the circuit blocks and the interconnect circuitry are fabricated from the single mask set;
• testing to determine whether the replaceable circuit modules are defective or functional;
• disconnecting a first set of the replaceable circuit modules from the interconnect circuitry;
• connecting a second set of the replaceable circuit modules to the interconnect circuitry, the second set comprising functional circuit modules;
• and
• selecting the number of circuit modules in the second set to correspond to the first size to form the first semiconductor device, or selecting the number of circuit modules in the second set to correspond to the second size to form the second semiconductor device.