Method for manufacturing semiconductor device having step of forming electrode pins on semiconductor chip using electrode-pin forming mask, and method for testing semiconductor chip using electrode-pin forming mask

Abstract

An electrode-pin forming mask is used to form electrode pins on the semiconductor chip. The electrode-pin forming mask has electrode-pin forming holes matching electrode pads previously formed on the semiconductor chip. A screen-printing technique is used to form the electrode pins on the semiconductor chip through the electrode-pin forming mask. That is, conductive material in a paste state is pushed into the electrode-pin forming holes in a condition where the electrode-pin forming mask has been placed on the semiconductor chip and positions of the electrode-pin forming holes match positions of the electrode pads of the semiconductor chip, respectively. The conductor material thus pushed into the electrode-pin forming holes is thus shaped as to form the electrode pins projecting from the electrode pads of the semiconductor chip. Then, the electrode-pin forming mask is removed from the semiconductor chip while the thus shaped conductor material continues to be projected from the electrode pads of the semiconductor chip. Thus, the electrode pins are formed on the semiconductor chip.

Dependencies are inferred from the claim text.