Method for forming fine patterns of semiconductor device
AssigneeHyundai Electronics Industries Co., Ltd.
InventorCheol Kyu Bok
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Abstract
There is provided a method for forming fine patterns in a semiconductor device without the falling down of the patterns, comprising the steps of: coating a photosensitive film on a wafer; patterning the photosensitive film by use of a light mask, followed by development, to form photosensitive film patterns; scattering a first washing solution on the wafer with spinning, to lie the first washing solution on the wafer including the photosensitive film patterns; scattering a second washing solution on the wafer to lie it thereon while spinning the wafer to remove the first washing solution out of the wafer; and spinning the wafer to dry the second washing solution.
Claims5
A method for forming fine patterns in a semiconductor device, comprising the steps of:
- coating a positive photosensitive film on a wafer;
- patterning the positive photosensitive film by use of a mask, followed by development, to form positive photosensitive film patterns;
- scattering deionized water on the wafer with spinning;
- scattering a liquid on the wafer while spinning the wafer to remove the deionized water out of the wafer, said liquid having a lower surface tension or a lower freezing point than deionized water;
- and
- in a vacuum, carrying out a step of spinning the wafer to dry the liquid.
A method for forming fine patterns in a semiconductor device, comprising the steps of:
- coating a negative photosensitive film on a wafer;
- patterning the negative photosensitive film by use of a mask to form negative photosensitive film patterns, the negative photoresist being cross-linked upon a first exposure with a first irradiation;
- scattering deionized water on the wafer with spinning;
- scattering deionized water warmed to room temperature on the wafer while spinning the wafer to remove the previous deionized water out of the wafer;
- to irradiating light upon the warmed deionized water.
- spinning the wafer to dry the warmed deionized water.
Dependencies are inferred from the claim text.