Liquid photosensitive resin composition for use in forming a relief structure

Abstract

Disclosed is a liquid photosensitive resin composition for use in forming a relief structure, comprising (A) an unsaturated polyurethane prepolymer comprising a plurality of diol segments comprising at least one polyester diol segment and at least one polyether diol segment, wherein the weight ratio of the at least one polyester diol segment to the at least one polyether diol segment is from 1:3 to 4:1, and wherein each of the at least one polyester diol segment is independently a polyester diol segment comprising recurring units of a unit represented by the following formula (1): ##STR1## wherein R.sup.1 represents a divalent aliphatic group or a divalent aromatic group, or a polyester diol segment comprising recurring units of a unit represented by the following formula (2): ##STR2## (B) an addition-polymerizable ethylenically unsaturated monomer, and (C) a photopolymerization initiator. When a relief structure is produced from the photosensitive resin composition of the present invention, the occurrence of the tunnel phenomenon in the relief portions of the produced relief structure can be suppressed, so that a relief structure (e.g., a printing plate) having improved durability can be obtained.

Dependencies are inferred from the claim text.