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US 5,843,371 AGranted
Lead-free soldering material having superior solderability
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChoong Sik Yoo, Mi Yeon Kim, Duk Yong Yoon
Life of this patent
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Abstract
A lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderability.
Claims4
A lead-free soldering material having a superior solderability, consisting essentially of, in weight %, 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn.
A lead-free soldering material having a superior solderability, consisting essentially of 3-4 wt % of Ag, 2-5 wt % of In, 6-14 wt % of Bi and a balance of Sn, and
- having a solidus line temperature of 187.degree.-199.degree. C. and a liquidus line temperature of 202.degree.-213.degree. C.
Dependencies are inferred from the claim text.