Method for applying an adhesive layer to a substrate surface

A method for fabricating a printhead for use in an ink jet printing device, comprising the steps of:

• (a) cleaning first and second silicon substrates, each having first and second parallel surfaces,
• (b) depositing a layer of insulating material on the surfaces of the substrates,
• (c) depositing a conductive layer on a first bonding surface of said second substrate,
• (d) forming an array of resistive material on the first surface of the first substrate for use as heating elements and forming a pattern of electrodes on the same substrate surface for enabling individual addressing of each heating element with current pulses,
• (e) photolithographically patterning the insulative layer on the second surface of the second substrate to produce at least one via therein for orientation dependent etching of at least one recess in the second substrate,
• (f) forming a plurality of grooves in the first surface of the second substrate, one end of the grooves communicating with the recess,
• (g) patterning the conductive layer to create a commonly connected conductive pattern,
• (h) electrophoretically depositing a polymeric adhesive over said conductive pattern,
• (i) aligning the first and second substrates with their first surfaces confronting and contacting each other, so that each groove contains a heating element therein,
• (j) curing the adhesive to bond the first and second substrates together to form the printhead, wherein the recess serves as an ink supplying manifold, the grooves serve as capillary filled channels and
• (k) cutting the bonded first and second substrates so as to intercept each of the grooves at their ends opposite their ends which communicate with the recess, thereby forming groove open ends which serve as the printhead nozzles.