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US 5,842,910 AGranted
Off-center grooved polish pad for CMP
AssigneeInternational Business Machines Corporation
InventorsTimothy Charles Krywanczyk, Douglas Keith Sturtevant, Matthew Thomas Tiersch
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Abstract
A method and apparatus for polishing a semiconductor wafer using a polishing pad. The polishing pad contains circumferential grooves which are located off center from the geometric center of the polishing pad.
Claims12
A polishing pad for polishing a semiconductor comprising:
- a pad face having a surface extending across a center of rotation;
- and
- a plurality of raised portions, on said pad face, sharing a common geometric center and extending in a generally circumferential direction, wherein said common geometric center is off-center with the center of rotation of the polishing pad.
A polishing pad for polishing a semiconductor comprising:
- a pad face having a surface extending across a center of rotation;
- and
- a plurality of grooves on said pad face, sharing a common geometric center and extending in a generally circumferential direction, wherein said common geometric center is off-center with the center of rotation of the polishing pad.
A polishing pad for polishing a semiconductor comprising:
- a pad having a surface extending across a center of rotation;
- and
- a grooved path area comprising grooves arranged in concentric rings, the grooved path area being on said Pad face and having a geometric center and extending in a generally circumferential direction, wherein said geometric center is off-center with the center of rotation of the polishing pad.
A method for polishing a semiconductor wafer comprising:
- providing a polishing pad with a plurality of raised portions, wherein the plurality of raised portions share a common geometric center which is off-center with a center of the polishing pad;
- attaching the polishing pad for rotation;
- attaching a semiconductor wafer such that the semiconductor wafer has a center offset from said center of the polishing pad;
- and
- polishing the semiconductor wafer.
2 more elements
A method for polishing a semiconductor comprising:
- providing a polishing pad with a plurality of raised portions having a geometric center off-center with a center of the polishing pad and a Plurality of channels located between the plurality of raised portions;
- attaching only one said polishing pad for rotation;
- and polishing a semiconductor wafer.
Dependencies are inferred from the claim text.