Shielded and impedance-matched connector assembly, and associated method, for radio frequency circuit device
AssigneeTelefonaktiebolaget L M Ericsson
InventorsLars Gunnar M.ang.rtensson, Stefan Karl Sture Cederblad, Hans Christer Arne Lundin
Life of this patent
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Abstract
A connector assembly, and associated method, connects a first circuit element portion and a second circuit element portion of a radio frequency circuit device together. Isolated conduction of a radio frequency signal between the first and second circuit element portions is provided. Appropriate selection of the relative dimensions of the connector assembly permits the characteristic impedance of the connector assembly to match the characteristic impedance of the circuit element portions.
Claims20
In a radio frequency circuit device having a first circuit element portion and a second circuit element portion, an improvement of a connector assembly for connecting the first circuit element portion together with the second circuit element portion to permit shielded conduction of a radio frequency signal between the first and second circuit element portions, respectively, said connector comprising:
- a centrally-positioned conductive element positioned between the first circuit element portion and the second circuit element portion, said centrally-positioned conductive element for forming a signal path for the conduction of the radio frequency signal between the first and second circuit element portions, respectively, said centrally-positioned conductive element defining a first diametrical dimension;
- and
- a plurality of circumferentially-positioned conductive elements positioned about said centrally-positioned conductive element and spaced-apart therefrom, said plurality of circumferentially-positioned conductive elements together substantially enclosing said centrally-positioned conductive element in radially-extending directions therefrom, opposing ones of said plurality of circumferentially-positioned conductive elements defining a second diametrical dimension, the first diametrical dimension and the second diametrical dimension together determinative, at least in part, of a characteristic impedance of said centrally-positioned conductive element and said plurality of circumferentially-positioned conductive elements, the first and second diametrical dimensions, respectively, selected such that the characteristic impedance is of a selected value.
In a radio frequency circuit device having a first circuit element portion and a second circuit element portion, an improvement of a connector assembly for connecting the first circuit element portion together with the second circuit element portion to permit conduction of a radio frequency signal between the first and second element portions, respectively, said connector comprising:
- a centrally-positioned solder-ball positioned between the first circuit element portion and the second circuit element portion, said. centrally-positioned solder-ball for forming a signal path for the conduction of the radio frequency signal between the first and second circuit element portions, respectively;
- and
- a plurality of circumferentially-positioned solder-balls positioned about said centrally-positioned solder-ball and spaced-apart therefrom, said plurality of circumferentially-positioned solder balls together substantially enclosing said centrally-positioned solder-ball in radially-extending directions therefrom, distances separating said plurality of circumferentially-positioned solder-balls and said centrally-positioned solder-ball determinative, at least in part, of a characteristic impedance of said centrally-positioned solder-ball together with said plurality of circumferentially-positioned solder-balls, respectively, the distances selected such that the characteristic impedance is of a selected value.
In a method for conducting a radio frequency signal in a radio frequency circuit device having a first circuit element portion and a second circuit element portion, an improvement of a method for connecting the first circuit element portion together with the second circuit element portion to permit isolated conduction of the radio frequency signal between the first and second circuit element portions, respectively, said method comprising the steps of:
- positioning a centrally-positioned conductive element between the first circuit element portion and the second circuit element portion, said centrally-positioned conductive element for forming a signal path for the conduction of the radio frequency signal between the first and second circuit element portions, respectively, the centrally-positioned conductive element defining a first diametrical dimension;
- and
- positioning a plurality of circumferentially-positioned conductive elements about said centrally-positioned conductive element and spaced-apart therefrom, said plurality of circumferentially-positioned conductive elements together substantially enclosing said centrally-positioned conductive element in radially-extending directions therefrom, opposing ones of said plurality of circumferentially-positioned conductive elements defining a second diametrical dimension, the first diametrical dimension and the second diametrical dimension together determinative, at least in part, of a characteristic impedance of said centrally-positioned conductive element and said plurality of circumferentially-positioned conductive elements, the first and second diametrical dimensions, respectively, selected such that the characteristic impedance is of a selected value.
A circuit assembly operable at radio frequencies, said circuit assembly comprising:
- a substrate having at least a signal pathline and a ground pathline formed thereon;
- at least a first layer of isolating dielectric material having a top face surface and a bottom face surface, the bottom face surface mounted upon said substrate;
- a first signal via formed to extend between the bottom and top face surfaces, respectively, of said first layer of isolating dielectric material, said first signal via for conducting a radio frequency signal between the bottom and top face surfaces of said first layer of isolating dielectric material, said first signal via defining a first diametrical dimension;
- a plurality of ground vias formed to extend between the bottom and top face surfaces, respectively, of said first layer of isolating dielectric material, said plurality of ground vias formed circumferentially about said first signal via and positioned radially therefrom, thereby to substantially enclose said first signal via, said plurality of ground vias for reducing emanations of electromagnetic energy generated during conduction of the radio frequency signal along said first signal via in radial directions beyond said plurality of ground vias, opposing ones of said plurality of circumferentially-positioned around vias defining a second diametrical dimension, the first diametrical dimension and the second diametrical dimension together determinative, at least in part, of a characteristic impedance of said first signal via and said plurality of ground vias, the first and second diametrical dimensions, respectively, selected such that the characteristic impedance is of a selected value;
- a centrally-positioned solder-ball positioned between said first signal via and the signal pathline of said substrate, said centrally-positioned solder-ball for conducting the radio frequency signal between the signal pathline of said substrate and said first signal via;
- and
- a plurality of circumferentially-positioned solder-balls positioned between, and electrically connecting, the ground pathline formed on said substrate and said plurality of ground vias extending through said first layer of isolating dielectric material, said plurality of circumferentially-positioned solder-balls extending in radial directions from said centrally-positioned solder-ball, thereby to substantially enclose said centrally-positioned solder-ball, said plurality of circumferentially-positioned solder-balls for shielding said centrally-positioned solder-ball during conduction of the radio frequency signal along said centrally-positioned solder-ball during conduction of the radio frequency signal between the signal pathline of said substrate and said first signal via.
An electronic manufacture for providing shielding and for minimizing signal loss, said electronic manufacture comprising:
- a first circuit portion having a first impedance;
- a second circuit portion having a second impedance, said second circuit portion connected to said first circuit portion, said second circuit portion including a centrally-positioned conductive element that defines a first preselected diametrical dimension, said second circuit portion also including a plurality of circumferentially-positioned conductive elements that substantially surround said centrally-positioned conductive element and that together define a second preselected diametrical dimension;
- wherein said first and second preselected diametrical dimensions are selected such that said second impedance substantially matches said first impedance.
Dependencies are inferred from the claim text.