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US 5,842,628 AGranted
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
AssigneeFujitsu Limited
InventorsRyuji Nomoto, Kazuto Tsuji, Mitsutaka Sato, Junichi Kasai
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Abstract
A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.
Claims8
A wire bonding method comprising:
- a first bonding process for forming a first ball-shaped part in a wire and bonding said first ball-shaped part to a first connected member;
- a ball-shaped part forming process for guiding said wire away from said first connected member so as to form a predetermined loop and forming a second ball-shaped part in a predetermined position in said wire;
- and
- a second bonding process for bonding said second ball-shaped part to a second connected member,
- said ball-shaped part forming process including guiding said wire using a member after said first ball-shaped part is bonded to said first connected member, and continuously guiding said wire using said member to form said predetermined loop, whereupon said second ball-shaped part is formed and bonded to the second connected member.
2 more elements
Dependencies are inferred from the claim text.