Soldering apparatus and a method thereof
AssigneeSony Corporation
InventorsTei Takanashi, Masuru Tan
Life of this patent
Estimating the term…
Abstract
A printed board, to which cream solders are applied on lands at the position where leads of electronic parts are to be soldered and the leads of the electronic parts are provided to the lands, is fed to a soldering position and, the cream solders of the fed printed board are spot heated and melted to solder the leads of the electronic parts to the lands. The molten solders are solidified by forced cooling to fix the leads of the electronic parts to the lands, and the printed board on which the leads of the electronic parts are fixed to the lands with the solidified solders is discharged from the soldering position.
Claims6
A reflow soldering method comprising the steps of:
- feeding to a soldering position a printed board to which cream solders are applied on lands at position where leads of electronic aparts are provided for soldering thereto,
- spot heating and melting said cream solders on said printed board fed to the soldering position,
- soldering said leads of said electronic parts of said lands,
- solidifying thereafter the molten solders by forced cooling, and
- discharging said printed board on which said leads of said electronic parts are fixed to said lands with the solidified solders from said soldering position.
A reflow soldering apparatus comprising:
- feeding means for feeding to a soldering position a printed board having cream solders applied on lands thereof at positions where leads of electronic parts are provided for soldering thereto,
- means for spot heating said cream solders of said printed board fed by said feeding means to said soldering position and for melting said cream solders to solder the leads of said electronic parts on said lands,
- forced cooling means for cooling and solidifying molten solders at said lands on said printed board, and
- discharge means for discharging said printed board on which the leads of said electronic parts are soldered to said lands with solidified solders.
Dependencies are inferred from the claim text.