Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
AssigneeHewlett-Packard Company
InventorWayne C. Schar
Life of this patent
Estimating the term…
Abstract
A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complete curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the interconnect. After assembly, un-filled underfill shrinks sufficiently to compress compliant adhesive and external clamping is largely eliminated. The method is scalable as low as about 6 mils with no real upper limit according to the percentage conductive particles by volume in the adhesive.
Claims10
A method of forming compliant adhesive conductive contacts directly on conductive sites of a substrate using a mask having apertures, the apertures configured in the mask to align with the conductive sites, comprising:
- providing conductive adhesive that remains compliant when cured;
- positioning the mask in proximity to the substrate and aligning the mask with the substrate such that the apertures align with the conductive sites;
- loading the mask apertures with the conductive adhesive;
- and
- removing the mask, to thereby leave the conductive adhesive directly on the conductive sites to form the compliant adhesive conductive contacts.
A method of electrically connecting a first substrate having a plurality of conductive sites to a second substrate having a plurality of conductive sites comprising:
- forming conductive adhesive deposits on selective conductive sites of the first substrate by
- positioning a mask having a plurality of apertures in proximity to the first substrate and aligning the mask with the first substrate such that the mask apertures align with the selective conductive sites of the first substrate,
- applying conductive adhesive to the mask such that the conductive adhesive loads the mask apertures, and
- removing the mask while the conductive adhesive is at least partially uncured;
- positioning the conductive adhesive deposits in registry with the conductive sites of the second substrate;
- and
- applying pressure external to the first substrate and the second substrate, to thereby form an electrical connection between the first substrate and the second substrate.
Dependencies are inferred from the claim text.