Semiconductor package extractor and method
AssigneeAdvanced Micro Devices, Inc.
InventorDaniel C. Ortiz
Life of this patent
Estimating the term…
Abstract
A semiconductor package extractor is provided that extracts a semiconductor package from a socket on a circuit board. The extractor has an outer base and an inner base which are attached via a bolt. Turning the bolt raises or lowers the inner base. The inner base has an inner frame with multiple levers that swing freely inward and outward attached to the inner frame. The levers swing outward to surround the semiconductor package as the inner base is lowered onto the inner base and underlying circuit board. The levers swing inward to securely grip the semiconductor package as the outer base is lowered onto the circuit board. As the bolt is turned, the inner base, gripping the semiconductor package, is raised, removing the semiconductor package from the circuit board.
Claims8
An apparatus for extracting a semiconductor package from a circuit board, comprising:
- (a) an outer base with a plurality of rigid sides defining an interior region there between;
- (b) an inner base, said inner base including:
- (i) a plurality of levers, each of said levers having an interior edge and an exterior edge;
- (ii) an inner frame to which said plurality of levers are pivotally attached;
- (iii) a swinging means formed on each of the interior edges of said plurality of levers for swinging said plurality of levers outwardly surrounding the semiconductor package on the circuit board;
- and
- (iv) a cut angle formed on each of the exterior edges of said plurality of levers for contacting a lower edge of said plurality of rigid sides of said outer base as said inner base enters the interior region of said outer base thereby causing said plurality of levers to swing inward grasping the semiconductor package;
- (c) a means for movably coupling said inner base to said outer base, said inner base located in the interior region of said outer base;
- and
- (d) a means for raising and lowering said inner base and said plurality of levers grasping the semiconductor package with respect to said outer base thereby removing the semiconductor package from the circuit board.
A method of extracting a semiconductor package from a circuit board comprising:
- providing a tool having an inner base surrounded by an outer base, said inner base having a plurality of levers, each of said levers having an interior lower edge and an exterior edge, each of said interior lower edge and exterior edge having a cut angle formed thereon;
- (c) lifting said tool relative to the circuit board, causing the plurality of levers grasping the semiconductor package, thereby removing the semiconductor package from the circuit board.
Dependencies are inferred from the claim text.