Apparatus for and method of fabricating semiconductor devices

An apparatus for fabricating semiconductor devices being adapted to carry out press working on a lead frame completely being sealed together with semiconductor chips mounted thereon, said apparatus comprising a plurality of press working means,

• each of said plurality of press working means comprising at least a pair of molds carrying out press working on said lead frame by holding and pressing the same, a press power source applying pressing force to said at least a pair of molds, and driving means for driving said press power source,
• said apparatus further comprising control means,
• said control means transmitting a signal indicating press working conditions corresponding to type and structure of said semiconductor devices on the basis of a previously provided variety signal expressing information on said type and structure to said driving means,
• said driving means driving said press power source to satisfy said press working conditions on the basis of said signal.

A method of fabricating semiconductor devices, being adapted to press work a lead frame being formed by integrally connecting a plurality of elemental leads each serving as a material for the lead of a single semiconductor device with each other while completely being sealed together with semiconductor chips mounted thereon, said method comprising:

• (a) a step of preparing a plurality of pairs of molds for carrying out press working on said lead frame by holding and pressing the same, including a pair of molds for elemental cutting being capable of cutting said lead frame to separate the same into respective said elemental leads;
• and
• (b) a step of press working said lead frame stepwise by successively employing said plurality of pairs of molds,
• said step (b) comprising:
• (b-1) a step of cutting said lead frame to separate the same into respective said elemental leads by employing said pair of molds for elemental cutting in advance of all other press working.

An apparatus for fabricating semiconductor devices, being adapted to carry out press working on a lead frame completely being sealed together with semiconductor chips mounted thereon by holding the same between fixed and movable molds and pressing the same, said apparatus comprising:

• a fixed mold holder being capable of receiving said fixed mold;
• a movable mold holder being capable of receiving said movable mold;
• a support member being opposed to said fixed mold holder through said movable mold holder and fixedly connected to said fixed mold holder through a connecting member;
• and
• a plurality of guide posts slidably supporting said movable mold holder on said support member in a direction opening/closing said fixed mold being mounted on said fixed mold holder and said movable mold being mounted on said movable mold holder,
• said connecting member being set only on one side about a virtual plane including portions of said fixed mold being mounted on said fixed mold holder and said movable mold being mounted on said movable mold holder receiving said lead frame and parallel to said opening/closing direction,
• said plurality of guide posts being arranged on positions putting said portions therebetween or surrounding the same substantially at a center thereof as viewed along said opening/closing direction, that or those of said plurality of guide posts being arranged at least on the other side of said virtual plane being not provided between said movable mold holder and said fixed mold holder.