Integrated thermal coupling for heat generating device
AssigneeDigital Equipment Corporation
InventorsWilliam R. Hamburgen, John S. Fitch
Life of this patent
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Abstract
In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.
Claims9
An apparatus for thermally coupling a heat source to a heat sink, comprising:
- a first substrate including a first side surface and a second side surface, a plurality of heat generating devices formed in the first side surface, and a plurality of first channels etched in the second side surface to form a plurality of first fins;
- a second substrate having a plurality of second channels etched therein to form a plurality of second fins and a base for thermally engaging with a heat sink, the first and second fins providing a thermally conductive path from the heat generating device to the heat sink when interleaved with each other.
Dependencies are inferred from the claim text.