# US 5,835,359 A · Electrical interconnect using particle enhanced joining of metal surfaces > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,835,359 A - Document ID: US5835359A - Status: Granted - Kind: A - Application number: 08/749,376 - Filed: 1996-11-06 - Granted: 1998-11-10 - Earliest claimed: 1990-02-14 - Assignees: Particle Interconnect, Inc. - Inventors: Louis DiFrancesco - Web page: https://patentgrep.com/patent/US5835359A ## CPC - B23K 35/02: characterised by mechanical features, e.g. shape - B23K 20/16: with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas - H05K 3/325: by abutting or pinching; Mechanical auxiliary parts therefor - H01H 1/06: characterised by the shape or structure of the contact-making surface, e.g. grooved - H05K 3/328: by welding - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10S 428/929: Electrical contact feature - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49126: Assembling bases - Y10T 428/12486: Laterally noncoextensive components [e.g., embedded, etc.] - Y10T 428/24999: Inorganic - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01H: ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B7/10; electrolytic self-interrupters H01G9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K17/00) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards. ## Claims ### Claim 1 An apparatus for coupling power transmission medium to a contact point, comprising: a crimp, said crimp including a patterned metal contact layer disposed thereon, including associated coated conductive particles dispersed within said metal contact layer and having a hardness greater than that of said metal contact layer; and means for applying compressive force normal to said crimp to compress said crimp with said power transmission medium; wherein a metal matrix is formed between said crimp and said power transmission medium when said particles pierce a power transmission medium surface. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein said power transmission medium is a high voltage medium. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein said power transmission medium is household electrical wiring. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein said metal matrix provides a mechanical bond to reduce slipping of said power transmission medium from said crimp. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein said metal matrix provides a low ohmic connection between said crimp and said power transmission medium. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein said particles pierce at least a first coating layer on either of said crimp or said power transmission medium surface to form said metal matrix. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein said particles are selected from the group consisting of electrically conductive, electrically insulative, thermally conductive, and thermally insulative particles. ### Claim 8 An apparatus for coupling a power transmission medium to a contact point, comprising: a crimp, said crimp including a patternable metal contact layer, including associated coated conductive particles dispersed within said metal contact layer having a hardness greater than that of said metal contact layer; and means for applying compressive force to compress said crimp with said power transmission medium; wherein a metal matrix is formed between said crimp and said power transmission medium when said particles pierce a power transmission medium surface. ### Claim 9 (depends on 8) The apparatus of claim 8, wherein said compressive force is applied normal to said metal contact layer. ### Claim 10 (depends on 8) The apparatus of claim 8, wherein said power transmission medium is a high voltage medium. ### Claim 11 (depends on 8) The apparatus of claim 8, wherein said power transmission medium is household electrical wiring. ### Claim 12 (depends on 8) The apparatus of claim 8, wherein said metal matrix provides a mechanical bond to reduce slipping of said power transmission medium from said crimp. ### Claim 13 (depends on 8) The apparatus of claim 8, wherein said metal matrix provides a low ohmic connection between said crimp and said power transmission medium. ### Claim 14 (depends on 8) The apparatus of claim 8, wherein said particles pierce at least a first coating layer on either of said crimp or said power transmission medium surface to form said metal matrix. ### Claim 15 (depends on 8) The apparatus of claim 8, wherein said particles are selected from the group consisting of electrically conductive, electrically insulative, thermally conductive, and thermally insulative particles. ### Claim 16 A method for coupling power transmission medium to a contact point, comprising the steps of: forming a crimp, said crimp including a patterned metal contact layer, including associated coated conductive particles dispersed within said metal contact layer having a hardness greater than that of said metal contact layer; and applying compressive force normal to said crimp to compress said crimp with said power transmission medium; wherein a metal matrix is formed between said crimp and said power transmission medium when said particles pierce a power transmission medium surface; wherein said matrix is selected from the group consisting of a temporary matrix, and a permanent matrix. ### Claim 17 (depends on 16) The method of claim 16, further comprising the step of piercing at least a first coating layer on either of said crimp or said power transmission medium surface with said particles to form said metal matrix.