Method for producing display device

A method of manufacturing a passive type liquid crystal display having a pair of first and second substrates and a liquid crystal disposed therebetween, the method comprising the following sequential steps of:

• preparing a driver circuit on a temporary substrate;
• attaching the driver circuit from the temporary substrate onto the first substrate;
• removing the temporary substrate from the driver circuit which is stuck on said temporary substrate;
• forming a sealing member on a periphery of one of the first and second substrates;
• and then
• mating the first and second substrates with the sealing member therebetween,
• wherein the sealing member is arranged so as to enclose the liquid crystal and the driver circuit between the first and second substrates.

A method of manufacturing a liquid crystal display device having a pair of first and second substrates and a liquid crystal disposed therebetween, comprising:

• forming a peeling layer comprising silicon on a glass substrate;
• forming an underlying film on the peeling layer;
• forming a semiconductor integrated circuit on the underlying film;
• forming a passivation film on the semiconductor integrated circuit;
• sticking a transfer substrate to the passivation film;
• etching the peeling layer by using a mixture of gas comprising ClF.sub.3 and N.sub.2, thereby separating said semiconductor integrated circuit from the glass substrate;
• after separating the semiconductor integrated circuit, attaching the semiconductor integrated circuit to one of said first and second substrates with said underlying film therebetween;
• removing the transfer substrate from said semiconductor integrated circuit;
• and
• forming an electrode arrangement on said one of the first and second substrates, said electrode arrangement being operationally connected to said semiconductor integrated circuit.

A method of manufacturing a liquid crystal display device having a pair of first and second substrates and a liquid crystal disposed therebetween, each of said first and second substrates having an electrode arrangement thereon, said method comprising:

• forming a peeling layer on a glass substrate;
• forming an underlying film on the peeling layer;
• forming a semiconductor integrated circuit on the underlying film;
• forming at least one passivation film over the semiconductor integrated circuit;
• forming a contact hole through the passivation film to expose a portion of said semiconductor integrated circuit;
• forming a lead on the passivation film, said lead being electrically connected to said semiconductor integrated circuit through the contact hole;
• forming a conductive bump on the lead;
• attaching said glass substrate provided with said semiconductor integrated circuit to one of the first and second substrates with an adhesive therebetween, wherein said semiconductor integrated circuit is electrically connected to the electrode arrangement of the one of the first and second substrates through said lead and said conductive bump;
• and
• etching the peeling layer for separating the semiconductor integrated circuit from the glass substrate.