Method of interfacing detector array layers

A method for interfacing arrays of infrared detectors to multi-layer integrated circuit modules, each layer having a plurality of conductive conduits formed thereon, the method comprising the steps of:

• a) forming an alignment board from an insulating material, the board having first and second opposing sides;
• b) forming a multiplicity of through-holes in the board extending between the first and second opposing sides;
• c) forming conductive vias in the through-holes, the vias having first ends at the first side of the board, and the vias having second ends at the second side of the board;
• d) forming sealing plugs of an insulating material in the conductive vias, the sealing plugs completely filling the vias;
• e) attaching first metallic pads to the first ends of the vias, the first metallic pads being sized larger than the first ends of the vias attached thereto;
• f) abutting a multi-layer intergrated circuit module to the first side of the alignment board, such that the conductive conduits on the layers of the modules are in electrical communication with the first ends of the conductive vias of the alignment board;
• and
• g) connecting a plurality of infrared detector arrays to the second side of the alignment board, such that the detectors are in electrical communication with the second ends of the conductive vias of the alignment board.