Liquid cooled heat sink for cooling electronic components
AssigneeAavid Thermal Products, Inc.
InventorRonald B. Lavochkin
Life of this patent
Estimating the term…
Abstract
A liquid cooled heat sink for cooling heat generating components. The heat sink has a base member with open ended channels formed in at least one surface thereof. The open ends of the channels have a span less than a span across a lower portion of the channels. A fluid conduit is disposed in said channels. The fluid conduit has an outer span greater than the span across the open ends of the channels and a flattened surface which is substantially coplanar with the surface of the heat sink base member having the channels therein.
Claims9
A liquid cooled heat sink for cooling a heat generating component in contact therewith, comprising:
- a heat sink base member having an open ended channel formed in one surface thereof, said channel including a curved lower wall and a pair of side walls, each sidewall having a first end continuous with said curved lower wall and a second end terminating at said surface, said sidewalls being tapered from said first ends to said second ends, the open end of the channel having a span less than a span across a lower portion of the channel;
- and
- a fluid conduit constructed of a thermally conducting material and disposed in said channel, said fluid conduit being disposed in said channel and having an outer span greater than the span across the open end of the channel for maintaining said fluid conduit in said channel by a friction fit formed between said side walls and said fluid conduit, said fluid conduit having a flattened surface which is substantially coplanar with said one surface of said heat sink base member, the heat generating component being disposed in use in direct contact with said one surface of said heat sink base member and in overlying abutting relation with said flattened surface for establishing direct thermal contact between the heat generating component and said flattened surface.
A liquid cooled heat sink for cooling heat generating components, comprising:
- a heat sink base member having channels formed in at least one surface thereof;
- a fluid conduit disposed in said channels, said fluid conduit having a flattened surface which is substantially coplanar with the surface of the heat sink base member having the channels therein, wherein at least one of said channels includes a local deformation rising from a surface of said at least one channel and said fluid conduit includes a local deformation directed toward the inside of said fluid conduit, said local deformation in said at least one channel and said local deformation in said fluid conduit being disposed adjacent to one another, and wherein said local deformation in said at least one channel is a ridge extending transverse to the direction of said fluid conduit.
A liquid cooled heat sink for cooling a heat generating component in contact therewith, comprising:
- a heat sink base member having an open ended channel formed in one surface thereof, said channel including a curved lower wall and a pair of side walls, with each sidewall having a first end continuous with said curved lower wall and a second end terminating at said surface, said sidewalls being tapered from said first ends to said second ends so that the open end of the channel has a span less than a span across a lower portion of the channel;
- and
- a fluid conduit constructed of thermally conductive material and disposed in said channels, said fluid conduit having a flattened surface which is substantially coplanar with said one surface of the heat sink base member and in direct contact with the heat generating component, wherein said channel includes a local deformation rising from a surface of said channel and said fluid conduit includes a deformation directed toward the inside of said fluid conduit, said local deformation in said channel and said local deformation in said fluid conduit being disposed adjacent to one another.
Dependencies are inferred from the claim text.