Low temperature method for evacuating and sealing field emission displays
AssigneeMicron Technology, Inc.
InventorsCharles M. Watkins, Danny Dynka
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AssigneeMicron Technology, Inc.
InventorsCharles M. Watkins, Danny Dynka
Estimating the term…
A method for evacuating and sealing a field emission display package and an improved field emission display package are provided. The field emission display package includes a face plate, a back plate and a peripheral seal formed between the face plate and back plate of a low melting point seal material such as indium or an alloy of indium. Within the sealed package components of a field emission display are mounted. These include a display screen formed on the face plate and a base plate flip chip mounted to the face plate. The peripheral seal is formed during a sealing and evacuating process performed in a reaction chamber at a reduced pressure. During the sealing and evacuating process the seal material is compressed. In addition, the sealing and evacuating process can be performed at approximately room temperature or alternately at temperature near the softening point of the seal material.
A method for evacuating and sealing a field emission display package, comprising:
A method for evacuating and sealing a field emission display package, comprising:
A method for evacuating and sealing a field emission display package, comprising:
A method for evacuating and sealing a field emission display package, comprising:
A method for evacuating and sealing a field emission display package, comprising:
Dependencies are inferred from the claim text.