Integrated circuit heat sink with rotatable heat pipe
AssigneeThermal Corp.
InventorsGeorge A. Meyer, IV, Jerome E. Toth
Life of this patent
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Abstract
An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.
Claims7
An apparatus for removing heat from an integrated circuit comprising:
- a heat conductive structure;
- a groove with sides extending below a surface of the heat conductive structure;
- a heat pipe placed into the groove, wherein the heat pipe is dimensioned to have clearance space between an outer surface of the heat pipe and the sides of the groove;
- tabs formed at the junction of the groove and the surface into which the groove is formed, wherein the tabs extending above the surface are permanently deformed by being bent over toward each other and into contact with the heat pipe;
- and
- heat conductive filler material occupying the space in the groove between the heat pipe and the sides of the groove.
Dependencies are inferred from the claim text.