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AssigneeSeagate Technology LLC
InventorsUri Cohen, Gene Patrick Bonnie
Estimating the term…
A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.
A process for pattern-etching an alumina layer, the process including the steps of:
A process for patterning an alumina layer, including the steps of:
A lift-off process for patterning an alumina layer, including the steps of:
A process for forming a pattern in an alumina layer, the process comprising:
A process for fabricating a TFH device, said process comprising:
A process for fabricating a TFH device, said process comprising:
A process for forming a plurality of devices, said process comprising:
A process for fabricating a TFH device comprising:
Dependencies are inferred from the claim text.