Method of applying a curable resin to a substrate for use in papermaking

A method of applying a curable resin to a substrate, the method comprising the steps of:

• providing a substrate having a first surface, a second surface, and a thickness, the substrate having voids intermediate the first and second surfaces;
• providing a curable liquid resin;
• providing a second material different from the curable liquid resin;
• applying the second material to the substrate to occupy at least some of the voids in the substrate intermediate the first and second surfaces of the substrate;
• changing the phase of at least some of the second material prior to applying the curable liquid resin to the substrate;
• applying the curable resin to the substrate;
• and
• curing at least some of the resin to provide a patterned resin layer on the substrate, the patterned resin layer having a continuous network surface having a plurality of discrete openings therein.