Stamp for a lithographic process
AssigneeInternational Business Machines Corporation
InventorsHans Andre Biebuyck, Bruno Michel
Life of this patent
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Abstract
A hybrid stamp structure for lithographic processing of features below 1 micron is described, comprising a deformable layer (14) for accommodating unevenness of the surface of a substrate, and a patterned layer on the deformable layer in which a lithographic pattern is engraved. The stamp structure is further enhanced by comprising a third layer (16), which acts as rigid support for the stamp, thus preventing an undesired deformation of the stamp under load.
Claims9
A stamp structure for a lithographic process, comprising a deformable first layer of a first material, and a second layer of a second material positioned on said deformable first layer, said second layer having a lithographic pattern to be transferred to a substrate, said deformable first layer deforming to permit conformal contact of said second layer to the surface of said substrate at times a load is applied.
A lithographic process comprising the steps of:
- selecting a stamp structure comprising a deformable first layer of a first material, and a second layer of a second material positioned on said deformable first layer, said second layer having a lithographic pattern to be transferred to a substrate, said deformable first layer deforming to permit conformal contact of said second layer to the surface of said substrate at times a load is applied;
- applying a substance to said patterned layer;
- and
- bringing said second layer into conformal contact with said surface of said substrate.
Dependencies are inferred from the claim text.