Multi-function heat dissipator
AssigneeDell USA, L.P.
InventorsJohn Jeffries, Ray Wang
Life of this patent
Estimating the term…
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AssigneeDell USA, L.P.
InventorsJohn Jeffries, Ray Wang
Estimating the term…
A method and apparatus simultaneously supporting a circuit board and dissipating heat from an electrical device on the circuit board. In a computer including the circuit board and a mother board connected to the circuit board, a heat dissipator not only dissipates any heat produced by the electrical device, but also secures the circuit board to the mother board. The heat dissipator includes three frame plates and two support plates, each made of a thermally conductive material. The first frame plate is directly connected to the electrical device. The first and second frame plates are proximate to and parallel with the front and back faces of the circuit board, respectively and the third frame plate connects the first and second frame plates. The first and second support plates attach the first and second frame plates, respectively, to the mother board.
A computer comprising:
A method for securing a daughter board to a mother board and simultaneously dissipating heat from an electrical device on the daughter board, the method comprising the steps of:
An apparatus for securing a daughter board to a mother board and simultaneously dissipating heat from a heat generating electrical component on the daughter board, the apparatus comprising:
Dependencies are inferred from the claim text.