Method of making small pores defined by a disposable internal spacer for use in chalcogenide memories
AssigneeMicron Technology, Inc.
InventorsGraham R. Wolstenholme, Steven T. Harshfield, Raymond A. Turi, Fernando Gonzalez, Guy T. Blalock, Donwon Park
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Abstract
A method for fabricating an ultra-small pore or contact for use in chalcogenide memory cells specifically and in semiconductor devices generally in which disposable spacers are utilized to fabricate ultra-small pores or contacts. The pores thus defined have minimum lateral dimensions ranging from approximately 500 to 4000 Angstroms. The pores thus defined may then be used to fabricate a chalcogenide memory cell or other semiconductor devices.
Claims38
A method of fabricating a pore, comprising:
- applying a layer of a first material onto a substrate material;
- forming an edge feature in said layer of said first material;
- applying a layer of a second material onto said edge feature of said layer of said first material;
- applying a layer of a third material onto said layer of said second material;
- removing a portion of said layer of said third material;
- and
- removing a portion of said layer of said second material to define a pore in said layer of said second material.
A method of fabricating a pore, comprising:
- applying a layer of a first material onto a substrate material;
- applying a layer of a second material onto said layer of said first material;
- forming an edge feature in said layer of said second material;
- forming an edge feature in said layer of said first material;
- applying a layer of a third material onto said edge features of said layers of said first and second materials;
- removing a portion of said layer of said third material;
- and
- removing a portion of said layer of said first material to define a pore in said layer of said first material.
A method of fabricating a pore, comprising:
- applying a layer of a first material onto a substrate material;
- applying a layer of a second material onto said layer of said first material;
- applying a layer of a third material onto said layer of said second material;
- forming an edge feature in said layer of said third material;
- applying a layer of a fourth material onto said edge feature of said layer of said third material;
- removing a portion of said layer of said fourth material;
- removing a portion of said layer of said second material to define a pore in said layer of said second material;
- and
- removing a portion of said layer of said first material to define a pore in said layer of said first material.
A method of fabricating a chalcogenide memory cell, comprising:
- applying a layer of a first material onto a conductive substrate material;
- forming an edge feature in said layer of said first material;
- applying a layer of a insulative material onto said edge feature of said layer of said first material;
- applying a layer of a third material onto said layer of said insulative material;
- removing a portion of said layer of said third material;
- removing a portion of said layer of said insulative material to define a pore in said layer of said insulative material;
- applying a layer of a chalcogenide material into said pore;
- and
- applying a layer of a conductive material onto said layer of said chalcogenide material.
A method of fabricating a chalcogenide memory cell, comprising:
- applying a layer of a insulative material onto a conductive substrate material;
- applying a layer of a second material onto said layer of said insulative material;
- forming an edge feature in said layer of said second material;
- forming an edge feature in said layer of said insulative material;
- applying a layer of a third material onto said edge features of said layers of said insulative and second materials;
- removing a portion of said layer of said third material;
- removing a portion of said layer of said insulative material to define a pore in said layer of said insulative material;
- applying a layer of a chalcogenide material into said pore;
- and
- applying a layer of a conductive material onto said layer of said chalcogenide material.
A method of fabricating a chalcogenide memory cell, comprising:
- applying a layer of an insulative material onto a conductive substrate material;
- applying a layer of a second material onto said layer of said insulative material;
- applying a layer of a third material onto said layer of said second material;
- forming an edge feature in said layer of said third material;
- applying a layer of a fourth material onto said edge feature of said layer of said third material;
- removing a portion of said layer of said fourth material;
- removing a portion of said layer of said second material to define a pore in said layer of said second material;
- removing a portion of said layer of said insulative material to define a pore in said layer of said insulative material;
- applying a layer of a chalcogenide material into said pore in said layer of said insulative material;
- and
- applying a layer of a conductive material onto said layer of said chalcogenide material.
Dependencies are inferred from the claim text.