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US 5,811,790 AGranted
Photoelectric conversion device having thermal conductive member
AssigneeCanon Kabushiki Kaisha
InventorsTadao Endo, Akira Funakoshi, Akira Tago, Shinichi Takeda, Eiichi Takami, Masakazu Morishita, Shinichi Hayashi, Chiori Mochizuki, Toshikazu Tamura, Minoru Watanabe
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Abstract
In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.
Claims23
A photoelectric conversion device comprising:
- photoelectric conversion means for receiving light that carries information and photoelectrically converting the light into an electrical signal;
- an integrated circuit element for processing the electrical signal converted by said photoelectric conversion means;
- and
- a housing which accomodates therein said photoelectric conversion element and said integrated circuit element,
- wherein a thermal conductive member for thermally connecting said integrated circuit element and said housing is interposed between said integrated circuit element and said housing.
2 more elements
A photoelectric conversion device comprising at least:
- a phosphor for absorbing radiation and emitting light;
- photoelectric conversion means for receiving the light emitted by said phosphor and photoelectrically converting the light into an electrical signal;
- an IC for processing the electrical signal converted by said photoelectric conversion means;
- a metal chassis for integrally holding the respective members and transmitting the radiation;
- and
- a member with a high thermal conductivity, which is interposed between at least a portion of said IC and said chassis and/or said radiation absorbing member.
3 more elements
Dependencies are inferred from the claim text.