Passivation of electroluminescent organic devices
AssigneeMotorola, Inc.
InventorsSong Q. Shi, Franky So, Thomas B. Harvey, III
Life of this patent
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Abstract
A method of passivating electroluminescent organic devices positioned on a supporting substrate including the steps of overcoating or capping the individual pixels, which form an array of electroluminescent organic devices, with a layer of stable metal, overcoating the layer of stable metal with a buffer system including a buffer layer of organic material and a thermal coefficient matching layer on the buffer layer, depositing a low permeability inorganic layer over the thermal coefficient matching layer, and sealing the electroluminescent organic device with an epoxy encapsulant or polymer laminated aluminum foil.
Claims28
A method of passivating organic devices comprising the steps of:
- providing an organic device on a supporting substrate defining a plurality of pixels, each of the plurality of pixels including a cathode comprised of a low work function metal;
- individually capping each of the plurality of pixels with a layer of indium;
- overcoating the plurality of pixels of the organic device, each individually capped by the layer of indium, with a buffer system for protection of the plurality of pixels from further process steps and materials, including a layer of organic material positioned on each layer of indium;
- depositing an inorganic layer over the buffer system;
- and
- sealing the organic device with a sealing layer of one of an epoxy encapsulant or a polymer laminated aluminum foil.
A method of passivating organic devices comprising the steps of:
- providing an array of organic LEDs on a supporting substrate defining a plurality of pixels, each of the plurality of pixels including a cathode comprised of a low work function metal;
- individually overcoating each of the plurality of pixels with a layer of indium;
- overcoating the layer of indium of each of the plurality of pixels with a layer of one of an organic polymer or an organometallic complex;
- depositing a thermal coefficient matching layer of a low work function metal on the layer of one of an organic polymer or an organometallic complex;
- depositing an inorganic layer of at least one of a layer of aluminum or indium over the thermal coefficient matching layer;
- and
- sealing the organic device with at least one of a layer of epoxy encapsulant or polymer laminated aluminum foil.
A passivated organic device comprising:
- an organic device on a supporting substrate defining a plurality of pixels, each of the plurality of pixels including a cathode comprised of a low work function metal;
- an overcoating layer of indium, individually capping the plurality of pixels;
- a buffer system including an overcoating layer of organic material coating the layer of indium, individually capping the pixels;
- an inorganic layer position on the buffer system;
- and
- a sealing layer positioned on the inorganic layer.
A passivated organic device as claimed in claim 20 wherein the gettering material includes a layer of low work function metal.
A passivated organic device comprising:
- an array of organic LEDs positioned on a supporting substrate, defining a plurality of pixels, each of the plurality of pixels including a cathode comprised of a low work function metal;
- a layer of indium individually overcoating each of the plurality of pixels of the organic device;
- a layer of one of an organic polymer or an organometallic complex overcoating the layer of indium;
- a thermal coefficient matching layer of low work function metal positioned on the layer of one of an organic polymer or an organometallic complex;
- an inorganic layer positioned on the thermal coefficient matching layer;
- and
- a sealing layer of at least one of an epoxy encapsulant or a polymer laminated aluminum foil positioned over the inorganic layer.
Dependencies are inferred from the claim text.