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US 5,809,633 AGranted
Method for producing a smart card module for contactless smart cards
AssigneeSiemens Aktiengesellschaft
InventorsJosef Mundigl, Detlef Houdeau
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Abstract
A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the antenna coil and the semiconductor chip are placed on a carrier body.
Claims3
A method for producing a smart card module, which comprises:
- bonding one end of a thin wire onto a first contact zone of a semiconductor chip;
- guiding the wire in a plurality of turns forming an antenna coil;
- bonding the wire onto a second contact area of the semiconductor chip;
- and
- placing the wire turns of the antenna coil and the semiconductor chip on a carrier body.
2 more elements
Dependencies are inferred from the claim text.