Sputtering target with ultra-fine, oriented grains and method of making same
AssigneeJohnson Matthey Electronics, Inc.
InventorsJohn Alden Dunlop, Jun Yuan, Janine Kiyabu Kardokus, Roger Alan Emigh
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AssigneeJohnson Matthey Electronics, Inc.
InventorsJohn Alden Dunlop, Jun Yuan, Janine Kiyabu Kardokus, Roger Alan Emigh
Estimating the term…
A sputtering target comprising a body of metal such as aluminum and its alloy with an ultrafine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece, and fabricating the workpiece to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.
A method for making a sputtering target comprising:
A method for making a sputtering target comprising:
A method for making a sputtering target comprising:
A method for making a sputtering target comprising:
A method for making a sputtering target comprising:
Dependencies are inferred from the claim text.