Electronic component assembly having an encapsulation material and method of forming the same
AssigneeMotorola, Inc.
InventorsPhillip C. Celaya, John R. Kerr
Life of this patent
Estimating the term…
Abstract
An electronic component assembly (10) is formed by mounting an electronic component (31) to a substrate (11). An encapsulating material (33) is used to protect the electronic component (31) from environmental hazards. The encapsulating material (33) is formed by dispensing an encapsulating fluid over the electronic component (31). A trench (36) is formed in a masking layer (21) on a substrate (11) to stop the flow of the encapsulating fluid. The trench (36) provides an edge (35) which acts as a discontinuity in the surface (23) of the masking layer (21). This discontinuity is sufficient to control the flow of the encapsulating fluid until the encapsulating fluid is cured to form the encapsulating material (33).
Claims14
An electronic component assembly comprising:
- a substrate;
- a masking layer overlying the substrate and having a surface, wherein there is a discontinuity at the surface of the masking layer to provide a wetting termination edge;
- an electronic component overlying the surface of the substrate;
- and
- an encapsulation material having an edge, wherein the encapsulation material overlies the electronic component and the edge of the encapsulation material is coincident with the wetting termination edge.
An electronic component assembly comprising:
- a printed circuit board;
- a masking layer overlying the printed circuit board, wherein the masking layer has a surface and a trench, the trench providing an edge at the surface of the masking layer;
- an electronic component overlying the printed circuit board, wherein at least a portion of the electronic component is encircled by the trench in the masking layer;
- and
- an encapsulation material having an edge and overlying the electronic component, wherein at least a portion of the edge of the encapsulation material coincides with the edge provided by the trench in the masking layer.
A method of assembling an electronic component comprising the steps of:
- providing a printed circuit board having an upper layer, wherein the upper layer has a surface and a trench that provides an edge;
- mounting the electronic component to the printed circuit board;
- and
- dispensing an encapsulation material, wherein the encapsulation material has an edge and a portion of the edge of the encapsulation material terminates at the edge provided by the trench.
Dependencies are inferred from the claim text.