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AssigneeInternational Business Machines Corporation
InventorsEmanuele Frank Lopergolo, Lewis Sigmund Goldmann, Joseph Michael Sullivan, Charles Russell Tompkins, Jr.
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The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed. The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.
An interconnect interposer comprising an electrically insulative body, said electrically insulative body having at least one electrically conductive interconnect probe providing an electrically conductive path, wherein said at least one electrically conductive interconnect probe has a rigid planar center portion, two retainer tabs connected to said rigid planar center portion to limit the floating of said at least one electrically conductive interconnect probe within said electrically insulative body, a first end and a second end, wherein at least said first end at least one of said first or second end said second end has a pre-formed deflective section, wherein a portion of said pre-formed deflective section has a protruding tip, wherein said pre-formed deflective section is narrower in cross-sectional area than said rigid center portion, wherein said rigid center portion is non-deflective, and wherein said electrically conductive path is from said first end through said non-deflective rigid center portion to said second end.
An interconnect interposer comprising an electrically insulative body having at least one hole to accommodate at least one electrically conductive interconnect probe, wherein said at least one electrically conductive interconnect probe has a rigid planar center portion having a first end and a second end and further having two retainer tabs connected to said rigid planar center portion to limit the floating of said at least one electrically conductive interconnect probe within said electrically insulative body, wherein at least said first end at least one of said first or second end said second end has a pre-formed deflective section, wherein a portion of said pre-formed deflective section is narrower in cross-sectional area than said rigid planar center portion, and wherein said rigid planar center portion is non-deflective.
A method for electrical interconnect comprising the steps of:
Dependencies are inferred from the claim text.