Non-corrosive stripping and cleaning composition
AssigneeOlin Microelectronic Chemicals, Inc.
InventorsKenji Honda, Richard M. Molin, Gale L. Hansen
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AssigneeOlin Microelectronic Chemicals, Inc.
InventorsKenji Honda, Richard M. Molin, Gale L. Hansen
Estimating the term…
The present invention is directed to a non-corrosive photoresist stripping and cleaning composition, comprising: (a) about 5% to about 50% solvent selected from the group consisting of N-methyl-2-pyrrolidinone, N-hydroxyethyl-2-pyrrolidinone, 1,3-dimethyl-2-imidazolidinone, dimethylsulfoxide, N,N-dimethylacetamide, diacetone alcohol, ethylene glycol, propylene glycol and admixtures thereof; (b) about 10% to about 90% of an alkanolamine selected from the group consisting of diethyleneglycolamine, monoethanolamine, diethanolamine, triethanolamine, 2-(2-aminoethylamino)ethanol, and admixtures thereof; (c) about 0.1% to about 4% of Formula I: ##STR1## where R.sub.1 -R.sub.4 are individually selected from the group consisting of hydrogen, alkyl groups having 1-4 carbon atoms, alkoxy groups having 1-4 carbon atoms, halogen groups, amino groups, hydroxyl groups, carboxyl groups or combinations thereof; and (d) about 0.1% to about 40% of water, all percentages by weight of the total stripping and cleaning composition.
A non-corrosive stripping and cleaning composition which is free of hydroxylamine compound, comprising:
A non-corrosive stripping and cleaning composition which is free of hydroxylamine compound comprising:
Dependencies are inferred from the claim text.