Back to results
US 5,795,215 AGranted
Method and apparatus for using a retaining ring to control the edge effect
AssigneeApplied Materials, Inc.
InventorsWilliam L. Guthrie, Tsungnan Cheng, Sen-Hou Ko, Harry Q. Lee, Michael T. Sherwood, Norm Shendon
Life of this patent
Estimating the term…
Abstract
A process using a retaining ring assembly of a carrier head to precompress a polishing pad to reduce or minimize the edge effect in a chemical mechanical polishing process.
Claims5
A method of chemically mechanically polishing a substrate, comprising the steps of:
- positioning a substrate adjacent to a polishing pad by means of a carrier head, said carrier head including a mounting assembly and a retaining ring;
- moving said substrate relative to said polishing pad;
- applying a first load to said mounting assembly to press said substrate against said polishing pad;
- selecting a second load to be applied by said retaining ring to minimize an edge effect on said substrate;
- and
- independently applying said second load to said retaining ring to press said retaining ring against said polishing pad.
3 more elements
Dependencies are inferred from the claim text.