Bonding material and bonding method for electric element

An electrical bonding assembly comprising:

• a semiconductor laser device having an electrode;
• a pedestal;
• and
• a bonding material bonding said electrode to said pedestal, said bonding material including an alloy consisting essentially of Au-Sn-Ni with Au as a main component, wherein a composition ratio of Ni is at least 1.3 wt %.

A mounting method of mounting an electrical element, comprising the steps of:

• forming an electrode layer on an electrical element;
• forming a Ni layer on said electrode layer;
• forming a solder layer composed of an Au-Sn alloy with Au as a main component directly on said Ni layer;
• and
• heating said electrical element so as to cause said solder layer and said Ni layer to mutually diffuse as well as said electrode layer to ohmically contact said electrical element, thereby forming an Au-Sn-Ni alloy containing at least 1.3 wt % Ni and bonding said electrical element to a pedestal.

An electrical bonding assembly comprising:

• an electrical element having an electrode;
• a pedestal;
• and
• a bonding material bonding said electrode to said pedestal, said bonding material including an alloy comprising Au-Sn-Ni with Au as a main component;
• wherein a composition ratio of Ni is at least 2.5 wt %.