Slurry recycling system for chemical-mechanical polishing apparatus
OwnerWilliam Yuehinventor
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Abstract
A slurry recycling system for a chemical-mechanical polishing apparatus includes an annular-shaped wafer polishing platen which rotates about a non-rotating center core. A slurry dispensing system housed in the center core directs a slurry mist radially into the path of a moving wafer. The recycling system is positioned at the periphery of the platen and is controlled by an end point monitoring and control system which uniquely provides instantaneous wafer removal rate data to regulate a slurry recycling valve.
Claims8
A slurry recycling system for chemical-mechanical polishing apparatus, said system including a platen rotatable about a center axis and having a periphery, said system including a slurry collection funnel positioned at said periphery, said system also including a means for dispensing slurry into the path of a wafer moving along said platen, a slurry conduit connecting said funnel and said means for dispensing slurry for recycling slurry from said funnel to said means for dispensing, said system including end point monitoring and control means for monitoring wafer removal rates, said slurry recycling system including a slurry control means in said conduit, said slurry control means being responsive to said end point control means for ensuring that the rate at which slurry is recycled corresponds to the instantaneous wafer removal rate.
Dependencies are inferred from the claim text.