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US 5,791,782 AGranted
Contact temperature probe with unrestrained orientation
AssigneeFusion Systems Corporation
InventorsDavid Wooten, Bruce Krein, Jianou Shi
Life of this patent
Estimating the term…
Abstract
A combination contact temperature probe/wafer support includes a thermocouple enclosing probe head of low thermal mass and large contact area supported by a support means such that 1) there is a high thermal resistivity connection between the support means and the probe head, and 2) the probe head is self orienting under the weight of the wafer so that the contact area is maintained coplanar with the surface of the wafer.
Claims10
A contact temperature probe for measuring the temperature of a semiconductor wafer, comprising,
- a contact temperature probe head comprising a flat contact section, a flat contact surface on said flat contact section on which the weight of said semiconductor wafer bears during use of said probe, and a temperature detection means disposed in said flat contact section, and
- support means arranged to be stationary during use of said probe, for supporting said probe head without constraining its orientation within a certain solid angle, such that said probe head may freely pivot within said solid angle under the weight of said semiconductor wafer.
Dependencies are inferred from the claim text.