Profiled substrate heating utilizing a support temperature and a substrate temperature
AssigneeApplied Materials, Inc.
InventorRoger N Anderson
Life of this patent
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Abstract
An apparatus and method for thermal processing, and more particularly for rapid thermal processing wherein a first thermal radiator generates and projects a first pattern of thermal radiation onto a first surface of a substrate, and wherein a second thermal radiator generates and projects a second pattern of thermal radiation onto a second surface of the substrate. The temperatures on the first and second surfaces are sensed by temperature sensors. A mechanism for selectively controlling the first and second thermal radiators in response to the temperature sensors causes a prescribed temperature profile to be produced within the substrate.
Claims16
A method for heating a substrate, comprising the steps of:
- supporting a substrate held substantially flat in face-to-face contact with a substantially planar upper surface of a support, a first heating apparatus heating an upper surface of said substrate and said upper surface of said support, a second heating apparatus heating a bottom surface of said support;
- sensing a substrate temperature from a first temperature sensor facing said upper surface of said support and sensing a support temperature from a second temperature sensor facing said lower surface of said support;
- setting at least one heating parameter;
- comparing said at least one heating parameter with said sensed substrate and support temperatures;
- and
- in response to said comparing step selectively adjusting said first heating apparatus relative to said second heating apparatus.
A method for heating a substrate, comprising the steps of:
- supporting a substrate on an upper surface of a support, a first heating apparatus heating an upper surface of said substrate and said upper surface of said support, a second heating apparatus heating a bottom surface of said support, at least one of said heating apparatus selectively heating a first heating zone on a surface facing thereto relative to a second heating zone on said surface facing thereto;
- sensing a substrate temperature with a first temperature sensor and sensing a support temperature with a second temperature sensor:
- setting at least one heating parameter;
- comparing said at least one heating parameter with both outputs of said two temperature sensors;
- and
- in response to said comparing step selectively adjusting a relative heating of said first and second heating zones.
A method for heating a substrate, said method comprising the steps of:
- supporting a substrate on a top surface of a susceptor, said susceptor having a bottom surface opposite said top surface;
- sensing a substrate temperature with a first temperature sensor positioned above said susceptor;
- sensing a susceptor temperature with a second temperature sensor positioned beneath said susceptor;
- and
- adjusting the heating of a first heater directed toward said top surface of said susceptor relative to the heating of a second heater directed towards said bottom surface as a susceptor in response to said sensed substrate temperature and said sensed susceptor temperature.
A method of heating a substrate, said method comprising the steps of:
- supporting a substrate on a first surface of a susceptor wherein said susceptor has a second surface opposite said first surface;
- heating said substrate and said first surface of said susceptor with a first heat source;
- heating said second surface of said susceptor with a second heat source;
- sensing a substrate temperature with a first temperature sensor;
- sensing a susceptor temperature with a second temperature sensor;
- and
- adjusting the heating of said first heat source relative to said second heat source in response to said sensed substrate temperature and said sensed susceptor temperature.
Dependencies are inferred from the claim text.