Underwater laser processing method and apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsKouki Okazaki, Arata Ito, Yuji Sano, Naruhiko Mukai, Nobutada Aoki, Chikara Konagai, Muneyoshi Kikunaga
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AssigneeKabushiki Kaisha Toshiba
InventorsKouki Okazaki, Arata Ito, Yuji Sano, Naruhiko Mukai, Nobutada Aoki, Chikara Konagai, Muneyoshi Kikunaga
Estimating the term…
An underwater laser processing method is carried out by irradiating, through a laser beam irradiation apparatus, a laser beam having a high output, a short pulse and a visible wavelength to a surface of a structure immersed in a water to improve residual stress of a material of the surface of the structure and remove a crack or a CRUD thereof. The laser beam irradiation apparatus comprises a pulse laser device suspended into a water in which a metal material is accommodated from an upper side thereof for irradiating a laser beam having a visible wavelength to a processing position, a beam strength adjusting device for adjusting an output per 1 pulse of a laser beam generated by the pulse laser device and a mechanism for adjusting a spot diameter and a multiplexing ratio of an irradiated beam.
An underwater laser processing method, comprising:
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