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US 5,783,550 AGranted
Mold removal composition and mold bleaching method
AssigneeS. C. Johnson & Son, Inc.
InventorsYasuhisa Kuriyama, Jun Kokubu, Yasuo Hiro, Yoshiko Tsuji, Tsuneo Kobayashi, Masahito Mikami, Shuzo Nakamura
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Abstract
A mold removal composition useful to remove molds adhered to furnishing and walls of homes, particularly kitchen sinks and bathroom walls, ceilings, and tiles, and a mold bleaching method are provided. The mold removal composition contains peroxide, dicyandiamide, alkali metal hydroxide or alkaline-earth metal hydroxide, and water. Its pH is 8.0-13.0.
Claims2
A mold removal composition, comprising:
- (a) 0.2-30 wt % of dicyandiamide;
- (b) 0.1-10 wt % of an alkali metal hydroxide or alkaline-earth metal hydroxide;
- (c) 40-99 wt % of water;
- and
- (d) 0.5-59.7 wt % of a peroxide, wherein the pH of the composition is 8.0-13.0.
2 more elements
A method of bleaching mold from a substrate, comprising applying to the substrate a composition comprising:
- (a) 0.2-30 wt % of dicyandiamide;
- (b) 0.1-10 wt % of an alkali metal hydroxide or alkaline-earth metal hydroxide;
- (c) 40-99 wt % of water;
- and
- (d) 0.5-59.7 wt % of a peroxide, wherein the pH of the composition is 8.0-13.0.
2 more elements
Dependencies are inferred from the claim text.