Grinding wheel having abrasive tips
AssigneeEhwa Diamond Ind. Co., Ltd.
InventorsJung Su Han, So Young Yun
Life of this patent
Estimating the term…
Loading patent…
AssigneeEhwa Diamond Ind. Co., Ltd.
InventorsJung Su Han, So Young Yun
Estimating the term…
A grinding wheel with tips which can be uniformly abraded regardless of the position of the tips is disclosed. In the wheel, the inside and outside tips may be formed by bonding diamond dust of the same concentration with resinoid or metal bonds of lower and higher abrasion resistances, respectively. Alternatively, the inside and outside tips may be formed using the same resinoid or metal bond. In this case, the outside tips are laden with diamond dust, while the inside tips are laden with no diamond dust or cheap abrasive. As a further alternative, the concentration of the diamond dust of the tips may be stepwisely reduced from the outside toward the inside. In addition, the top surface of each tip may be inclined downward from the outside toward the inside to compensate for the eccentric abrasion of the tips due to the circumferential speed difference between the inside and outside tips.
A grinding wheel having a plurality of abrasive tips arranged radially over one side of a disc-shaped sheet, said disc-shaped sheet having an outer periphery and a center, wherein said tips have different concentrations of diamond dust in a way such that the concentration of the diamond dust decreases from tips being near the outer periphery toward tips being near the center of the sheet.
Dependencies are inferred from the claim text.