Back to results
US 5,779,921 AGranted
Method for selectively plating an organic substrate
AssigneeW. L. Gore & Associates, Inc.
InventorsRandy E. Haslow, Donald G. Hutchins, Michael R. Leaf
Life of this patent
Estimating the term…
Abstract
The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses
Claims36
A method for making a substrate having differential front to back terminal metal thickness comprising the steps of:
- a) providing an organic based substrate having a conductive metal layer on a front and back side thereof;
- b) protecting the back side of the substrate, metallizing the front side wherein said metallizing is conducted by electroplating while electrically bussing the front side with the back side;
- and
- c) unprotecting the back side and protecting the front side and metallizing the back side by at least one of electroless plating or immersion plating.
1 more element
Dependencies are inferred from the claim text.