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US 5,777,540 AGranted
Encapsulated fuse having a conductive polymer and non-cured deoxidant
AssigneeCTS Corporation
InventorsRonald J. Dedert, Steven J. Hreha, William A. Hollinger, Jr.
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Abstract
A simplified method of manufacturing an electrothermal fuse includes the steps of screening conductive epoxy onto fuse link termination pads, placing a metal alloy fuse link into the conductive epoxy on the termination pads, curing the conductive epoxy, applying deoxidant, applying encapsulant, and curing the encapsulant. The resultant fuse of the preferred embodiment comprises a substrate, termination pads, conductive epoxy interconnects, a solder type fuse link, liquid deoxidant and encapsulant.
Claims6
An electrothermal fusing circuit comprising:
- two terminations;
- a meltable fuse link extending between said two terminations;
- a conductive polymer interconnecting said two terminations to said meltable fuse link;
- a non-cured deoxidant protecting said fuse link from oxidation;
- an encapsulant, said encapsulant encapsulating said fuse link and said non-cured deoxidant.
2 more elements
Dependencies are inferred from the claim text.