Interconnect system and method of fabrication
AssigneeMotorola, Inc.
InventorsDouglas G. Mitchell, Francis J. Carney, Eric J. Woolsey
Life of this patent
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Abstract
An interconnect system (31) includes an interconnect bump (29) over an under bump metallurgy (25). The under bump metallurgy (25) includes a barrier layer (26) having a barrier material such as titanium, an adhesion layer (28) having an adhesion material such as copper, and a mixture layer (27) having both the barrier material and the adhesion material. The mixture layer (27) is located between the barrier layer (26) and the adhesion layer (28), and the adhesion layer (28) is located between the mixture layer (27) and the interconnect bump (29). The interconnect bump (29) contains solder and is used as an etch mask when patterning the under bump metallurgy (25).
Claims11
A method of manufacturing an interconnect system, the method comprising the steps of:
- providing a substrate;
- disposing an electrically conductive layer over the substrate;
- disposing a first layer over the electrically conductive layer, the first layer comprising a barrier material;
- disposing a second layer over the first layer, the second layer comprising an adhesion material and the barrier material;
- and
- disposing a third layer over the second layer after the step of disposing the second layer, the third layer comprising the adhesion material.
A method of manufacturing a semiconductor component, the method comprising the steps of:
- providing a semiconductor substrate;
- fabricating an integrated circuit in the semiconductor substrate;
- forming a metal layer over the semiconductor substrate, the metal layer coupled to the integrated circuit;
- sputtering a barrier layer over the metal layer, the barrier layer having a barrier material;
- sputtering a mixture layer over the barrier layer, the mixture layer having the barrier material and an adhesion material;
- sputtering an adhesion layer over the mixture layer, the adhesion layer having the adhesion material;
- forming an interconnect bump over the adhesion layer;
- and
- using the interconnect bump as an etch mask while etching the adhesion layer, the mixture layer, and the barrier layer.
Dependencies are inferred from the claim text.