US 5,766,819 A · Donor elements, assemblages, and associated processes with flexible ejection layer(s) for laser-induced thermal transfer

Abstract

Donor elements, assemblages, and associated processes are described for use in a laser-induced thermal transfer process, said elements comprising in the order listed (a) at least one flexible ejection layer comprising a first polymer having a decomposition temperature T.sub.1 and characteristic glass transition temperatures of T.sub.g.sup.0 and T.sub.g.sup.1 for unplasticized and plasticized polymer samples, respectively, wherein the tensile modulus of the flexible ejection layer(s) structure is less than or equal to 2.5 Gigapascals; (b) at least one heating layer; (c) at least one transfer layer comprising (i) a second polymer having a decomposition temperature T.sub.2, wherein T.sub.2 .gtoreq.(T.sub.1 +100.degree. C.) and (ii) an imageable component, with the proviso in some embodiments that an inflexible support substrate is absent in the donor element at least during the thermal transfer process or in other embodiments that a support is absent in the donor element at least during the thermal transfer process. These donor elements are useful in proofing and lithographic printing applications. Assemblages made with these donor elements are useful for fabrication of photomasks on various photohardenable materials, including flexographic printing plates and photoresists. These photomasks are useful in creating a relief image with a photosensitive element, such as flexographic printing plate or a photoresist.

Claims39

Dependent claims

A donor element for use in a laser-induced thermal transfer process, said element comprising in the order listed:

(a) at least one flexible ejection layer comprising a first polymer having a decomposition temperature T.sub.1 ;
(b) at least one heating layer;
and
(c) at least one transfer layer comprising (i) a second polymer having a decomposition temperature T.sub.2 and (ii) an imageable component, wherein T.sub.2 .gtoreq.(T.sub.1 +100.degree. C.);
with the proviso that the donor element during the transfer process does not include an inflexible support substrate having a tensile modulus of.gtoreq.2.9 GPa.

2 more elements

A donor element for use in a laser-induced thermal transfer process, said element comprising in the order listed:

(a) a flexible bottom layer wherein said layer comprises a polymeric material and wherein the layer has a tensile modulus of .ltoreq.2.5 GPa;
(b) at least one ejection layer comprising a first polymer having a decomposition temperature T.sub.1 ;
(c) at least one heating layer;
and
(d) at least one transfer layer comprising (i) a second polymer having a decomposition temperature T.sub.2 and (ii) an imageable component;
and an optional thermal amplification additive is present in at least one of layers (b) and (d) or both;
with the proviso that the donor element does not include an inflexible support having a tensile modulus of .gtoreq.2.9 GPa and wherein the polymer in layer (a) may be the same or different as the first polymer in layer (b).

4 more elements

An assemblage for use in a laser-induced thermal transfer process, the assemblage comprising:

(A) a photosensitive receiver element comprising in order:
(A1) a receiver support;
(A2) a photohardenable layer comprising a binder, at least one photohardenable component, and an initiator;
(A3) optionally a barrier layer;
and
(A4) optionally a coversheet;
(B) a donor element comprising in order;
(B1) at least one flexible ejection layer comprising a first polymer having a decomposition temperature T.sub.1 ;
(B2) at least one heating layer;
(B3) at least one transfer layer having an outer surface and comprising (i) a second polymer having a decomposition temperature T.sub.2 and (ii) an imageable component, wherein T.sub.2 is greater than or equal to (T.sub.1 +100.degree. C.);
wherein the outer surface of the transfer layer (B3) is adjacent to and in contact with a layer of the photosensitive receiver element selected from the group consisting of the photohardenable layer (A2), the optional barrier layer (A3), and the optional coversheet (A4);
wherein a photomask is prepared on the photosensitive receiver element according to the laser-induced thermal transfer process;
and
with the proviso that the donor element at least during the transfer process does not include an inflexible support substrate having a tensile modulus of greater than or equal to 2.9 GPa.

11 more elements

A laser-induced, thermal transfer process which comprises:

(1) imagewise exposing to laser radiation a laserable assemblage comprising:
(A) a photosensitive receiver element comprising in order:
(A1) a receiver support;
(A2) a photohardenable layer comprising a binder, at least one photohardenable component, and an initiator;
(A3) optionally a barrier layer;
and
(A4) optionally a cover sheet;
(B) a donor element comprising in order:
(B1) at least one flexible ejection layer comprising a first polymer having a decomposition temperature T.sub.1 ;
(B2) at least one heating layer;
(B3) at least one transfer layer having an outer surface and comprising (i) a second polymer having a decomposition temperature T.sub.2 and (ii) an imageable component, wherein T.sub.2 is greater than or equal to (T.sub.1 +100.degree. C.);
wherein the outer surface of the transfer layer (B3) is adjacent to and in contact with a layer of the photosensitive receiver element selected from the group consisting of the photohardenable layer (A2), the optional barrier layer (A3), and the optional coversheet (A4);
the imagewise exposure results in exposed areas of the transfer layer (B3) being transferred to the adjacent layer of the photosensitive receiver element;
and
with the proviso that the donor element at least during the transfer process does not include an inflexible support substrate having a tensile modulus of greater than or equal to 2.9 GPa;
and
(2) separating the donor element from the receiver element, thereby forming a photomask on the photosensitive receiver element.

14 more elements

Dependencies are inferred from the claim text.

Donor elements, assemblages, and associated processes with flexible ejection layer(s) for laser-induced thermal transfer

Life of this patent

Donor elements, assemblages, and associated processes with flexible ejection layer(s) for laser-induced thermal transfer

Life of this patent

Abstract

Claims39