Piezoelectric device and method of manufacturing the same

A manufacturing method for a piezoelectric device, comprising the steps of:

• (1) mirror finishing principal surfaces of a first substrate and a second substrate said second substrate comprising a piezoelectric element;
• (2) forming a plurality of grooves on at least one of said principal surfaces of said first and second substrates;
• (3) joining said principal surfaces of said first substrate and said second substrate;
• (4) reducing the thickness of said second substrate;
• (5) applying heat to the joined substrates and bonding the joined substrates;
• (6) forming an opening in said first substrate such that an area of said second substrate is exposed through said opening;
• (7) forming a plurality of piezoelectric devices by forming electrodes on the exposed area of said second substrate through said opening and on a rear side of said second substrate at an area corresponding to the exposed area;
• and
• (8) dividing the bonded substrates into portions each having one of said plurality of piezoelectric devices.

A manufacturing method for a piezoelectric device, comprising the steps of:

• (1) mirror finishing principal surface of a first substrate and a second substrate, said second substrate comprising a piezoelectric element;
• (2) forming a plurality of grooves on at least one of said principal surfaces of said first and second substrates;
• (3) joining said principal surfaces of said first and second substrates;
• (4) dividing said second substrate into a plurality of portions,
• (5) applying heat to said joined substrates and bonding the joined substrates;
• (6) forming an opening in said first substrate so that an area of said second substrate is exposed through said opening;
• (7) forming a plurality of piezoelectric devices by forming an electrode on the exposed area of said second substrate through said opening and on a rear side of said second substrate at an area corresponding to the exposed area;
• and
• (8) dividing the bonding substrates into portions each having one of said plurality of piezoelectric devices.

A manufacturing method for a piezoelectric device, comprising the steps of:

• (1) mirror finishing principal surfaces of a first substrate and a second substrate said second substrate comprising a piezoelectric element;
• (2) forming a plurality of grooves on at least one of the principal surfaces of said first and second substrate;
• (3) joining said principal surfaces of said first substrate and second substrates;
• (4) reducing the thickness of said second substrate;
• (5) dividing said second substrate into a plurality of areas;
• (6) applying heat to the joined substrates and bonding the joined substrates;
• (7) forming an opening in said first substrate such that an area of said second substrate is exposed through said opening;
• (8) forming a plurality of piezoelectric devices by forming an electrode on the exposed area of said second substrate through said opening and on a rear side of said second substrate at an area corresponding to the exposed area;
• and
• (9) dividing the bonded substrates into portions each having one of said plurality of piezoelectric devices.

A manufacturing method for a piezoelectric device, comprising the steps of:

• (1) mirror finishing principal surfaces of a first substrate and a second substrate, said second substrate comprising a piezoelectric element;
• (2) forming a plurality of grooves on at least one of said principal surfaces of said first and second substrate;
• (3) joining said principal surfaces of said first substrate and second substrate;
• (4) dividing the joined substrates into a plurality of areas;
• (5) applying heat to the joined substrates and bonding the joined substrates;
• (6) forming an opening on each of the divided substrates so that a part of said second substrate is exposed through said opening;
• and
• (7) forming an electrode on at least one of the exposed parts of said second substrate through said opening and on a rear side of said second substrate at an area corresponding to the exposed area.

A manufacturing method for a piezoelectric device, comprising the steps of:

• (1) mirror finishing principal surfaces of a first substrate and a second substrate said second substrate comprising a piezoelectric element;
• (2) forming a plurality of grooves on at least one of said principal surfaces of said first and second substrates;
• (3) washing said first substrate and said second substrate;
• (4) joining said principal surfaces of said first substrate and second substrate;
• (5) filling said grooves through edges of the joined substrates with filler;
• (6) applying heat to the joined substrates and bonding the joined substrates;
• (7) removing a part of said first substrate down to said second substrate;
• (8) forming an electrode on said second substrate where said first substrate has been removed;
• and
• (9) dividing the bonded substrates along at least a part of said grooves.