Plasma treatment apparatus and method
AssigneeSeiko Epson Corporation
InventorsNaoyuki Iwamura, Yasutsugu Aoki
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AssigneeSeiko Epson Corporation
InventorsNaoyuki Iwamura, Yasutsugu Aoki
Estimating the term…
A plasma treatment and apparatus which enables improved uniform plasma treatment over the entire surface of an object to be treated, improved yield, and higher treatment speed is provided. In a gas introduction passage, the gas capable of plasma discharge is preexcited to raise its level of excitation. A first pair of plasma generation electrodes downstream along the gas flow passage use the preexcited gas to generate a plasma in a first plasma generation position. Further downstream, a second pair of plasma generation electrodes positioned in a second plasma generation position, where the activated state of the gas activated in the first plasma region is maintained, activates the gas to generate a plasma containing activated gas species. The object to be treated is treated by the activated gas species in the second plasma region.
A plasma treatment apparatus for treating a surface of an object to be treated, comprising:
A plasma treatment apparatus for treating a surface of an object to be treated, comprising:
A plasma treatment apparatus for treating an object, comprising:
A method of plasma treating a surface of an object, comprising the steps of:
A method of plasma treating a treatment surface of an object to be treated, comprising:
A method of plasma treating a treatment surface of an object, comprising:
Dependencies are inferred from the claim text.