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US 5,751,065 AGranted
Integrated circuit with active devices under bond pads
AssigneeLucent Technologies Inc.
InventorsSailesh Chittipeddi, William Thomas Cochran, Yehuda Smooha
Life of this patent
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Abstract
Active circuitry is placed under the bond pads in an integrated circuit having at least three metal levels. The metal level adjacent the bond pad level acts as a buffer and provides stress relief and prevents leakage currents between the bond pad and underlying circuitry.
Claims11
An integrated circuit comprising:
- a substrate;
- active devices formed on the surface of said substrate;
- a bond pad formed substantially over a portion of said active devices, said bond pad having a footprint;
- a patterned metal layer having a footprint and located between said bond pad and said substrate, said metal layer being substantially over said active devices, said footprint of said bond pad substantially overlying said footprint of said patterned metal layer;
- a first dielectric layer separating said patterned metal layer from said bond pad, said patterned metal layer being electrically isolated from said active devices by a second dielectric layer;
- and
- electrical connections from said bond pad to said active device and from said patterned metal layer to said bond pad or said active devices.
4 more elements
An integrated circuit comprising:
- a substrate;
- active devices formed on the surface of said substrate;
- a plurality of bond pads, at least one of said bond pads being substantially over at least one of said active devices, said bond pad having a footprint;
- a patterned metal layer having a footprint and located between each of said plurality of bond pads and said substrate, at least a porion of said metal layers being substantially over at least one of said active devices, each of said metal layers being electrically isolated from said active devices by a first dielectric material, said footprint of said bond pad substantially overlying said footprint of said patterned metal layer;
- a second dielectric material separating each of said patterned metal layer from said bond pads, each of said patterned metal layers forming a barrier between said first dielectric material and said active devices that substantially prevent current leakage between said second dielectric material and said active devices;
- and
- electrical connections from said bond pads to said active devices.
4 more elements
Dependencies are inferred from the claim text.