Apparatus and method for dynamically mixing slurry for chemical mechanical polishing

A method of dynamically mixing slurry for chemical mechanical polishing, the method comprising the steps of:

• providing an oxidizer, an abrasive, and a slurry mixer;
• dispensing the oxidizer and the abrasive into the slurry mixer;
• dynamically blending the oxidizer and the abrasive together to form the slurry in the slurry mixer;
• stratifying the slurry in the slurry mixer, wherein the step of providing the slurry mixer includes providing a slurry mixer comprised of polypropylene, wherein interior walls of the slurry mixer are smooth;
• retaining the slurry in the slurry mixer for a time period of less than approximately thirty minutes;
• subsequently, removing the slurry from the slurry mixer;
• and
• dispensing the slurry onto a polishing surface.

A method of dynamically mixing slurry for chemical mechanical polishing, the method comprising the steps of:

• providing an oxidizer, an abrasive, and a slurry mixer;
• dispensing the oxidizer and the abrasive into the slurry mixer;
• dynamically blending the oxidizer and the abrasive together to form the slurry in the slurry mixer;
• retaining the slurry in the slurry mixer for a time period of less than approximately thirty minutes;
• subsequently, removing the slurry from the slurry mixer;
• and
• dispensing the slurry onto a polishing surface wherein the step of retaining the slurry in the slurry mixer includes providing a delay of approximately fifteen seconds to five minutes between the step of dynamically blending the oxidizer and the abrasive and the step of dispensing the slurry onto the polishing surface.

A method of dynamically mixing slurry for chemical mechanical polishing, the method comprising the steps of:

• providing an oxidizer, an abrasive, and a slurry mixer;
• dispensing the oxidizer and the abrasive into the slurry mixer;
• dynamically blending the oxidizer and the abrasive together to form the slurry in the slurry mixer;
• retaining the slurry in the slurry mixer for a time period of less than approximately thirty minutes;
• subsequently, removing the slurry from the slurry mixer;
• and
• dispensing the slurry onto a polishing surface,
• wherein the step of removing the slurry from the slurry mixer includes using pressure generated from the step of dispensing the oxidizer and the abrasive into the slurry mixer to remove the slurry from the slurry mixer.

A method of manufacturing a semiconductor component, the method comprising the steps of:

• mixing a first chemical and a second chemical into a mixture;
• providing a residence time for the mixture, wherein the residence time is greater than approximately fifteen seconds and less than approximately thirty minutes;
• and
• dispensing the mixture after the residence time.

A method of manufacturing a semiconductor component, the method comprising the steps of:

• mixing a first chemical and a second chemical into a mixture;
• providing a residence time for the mixture, wherein the residence time is less than approximately thirty minutes;
• and
• dispensing the mixture after the residence time,
• wherein the step of mixing the first and second chemicals includes using a magnetically coupled stirrer in a first portion of a chamber separated from a second portion of the chamber by a grating, wherein the step of mixing the first and second chemicals includes mixing the first and second chemicals in the first portion of the chamber and wherein the step of dispensing the mixture includes dispensing the mixture from the second portion of the chamber.

A method of making an electronic device comprising:

• providing a substrate;
• providing a slurry;
• transporting the slurry through a diffuser;
• and
• applying the slurry to the substrate after the transporting step.

A method of manufacturing a semiconductor component, the method comprising the steps of:

• providing a container having a perforated diffuser between an upper portion and a lower portion;
• providing a first reservoir having a chemical;
• providing a second reservoir having an abrasive;
• extracting the chemical from the first reservoir and into the lower portion of the container;
• extracting the abrasive from the second reservoir and into the lower portion of the container;
• combining the chemical and the abrasive into a mixture in the lower portion of the container;
• transporting the mixture through perforated diffuser into the upper portion of the container;
• keeping the mixture in the container for a time period;
• and
• thereafter, dispensing the mixture from the container through a tap.

A method of manufacturing a semiconductor component comprising:

• providing a substrate;
• providing a slurry;
• providing a perforated plate;
• passing the slurry through the perforated plate;
• and
• chemical mechanical polishing the substrate with the slurry after the passing step.

A method of manufacturing a semiconductor component comprising:

• dynamically blending a slurry;
• conducting the slurry through a diffuser;
• and
• thereafter, using the slurry to polish a substrate.

An apparatus for mixing chemicals, the apparatus comprising:

• a container having an upper portion and a lower portion, the lower portion having a bottom surface;
• a diffuser between the upper portion and the lower portion;
• an input at the lower portion of the container;
• a mixing structure in the lower portion of the container;
• and
• an output at the upper portion of the container.

An apparatus for manufacturing semiconductor devices, the apparatus comprising:

• a container having a first portion and a second portion;
• a diffuser between the first and second portions;
• an input port in the first portion of the container;
• a mixing device in the first portion of the container;
• and
• an output port in the second portion of the container.