Solid buffing compound
OwnerToshikazu Tabatainventor
Life of this patent
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Abstract
A solid buffing compound made up of polishing powder and a bonding agent, wherein the bonding agent to be used is a good amount of water-soluble surface active agent and/or polyalkylene glycol which is an intermediate thereof; the melting point of said bonding agent is 30.degree. C. or more, and said bonding agent is water soluble so that a buff residue adhering on the surface of product, etc. after buffing may be washed out easily by use of water.
Claims3
Buffing equipment for polishing a metal surface comprising a buff and a solid buffing compound applied to the buff, the solid buffing compound comprising a mixture of polishing powder and a bonding agent substantially made of a water soluble surface active agent, wherein said bonding agent is water soluble and has a melting point of 40.degree. to 80.degree. C.
Buffing equipment for polishing a metal surface comprising a buff and a solid buffing compound applied to the buff, the solid buffing compound comprising a mixture of polishing powder and a bonding agent substantially made of polyalkylene glycol which is an intermediate of a water soluble surface active agent, wherein said bonding agent is water soluble and has a melting point of 40.degree. to 80.degree. C.
Buffing equipment for polishing a metal surface comprising a buff and a solid buffing compound applied to the buff, the solid buffing compound comprising a mixture of polishing powder and a bonding agent substantially made of a water soluble surface active agent and polyalkylene glycol which is an intermediate of said water soluble surface active agent, wherein said bonding agent is water soluble and has a melting point of 40.degree. to 80.degree. C.
Dependencies are inferred from the claim text.